| 원래 장소: | 중국 |
|---|---|
| 브랜드 이름: | Supermicro |
| 모델 번호: | SYS-822GS-NB3RT |
| 최소 주문 수량: | 1/세트 |
| 배달 시간: | 2-3 일 |
| 지불 조건: | t/t |
| 공급 능력: | 주당 50pc |
| 폼 팩터: | 8U 랙마운트 | 프로세서: | P-코어가 있는 Intel® Xeon® 6700/6500 시리즈 프로세서 |
|---|---|---|---|
| GPU: | 최대 GPU 수: 온보드 GPU 8개 지원되는 GPU: NVIDIA SXM: HGX B300 8-GPU(288GB) GPU-GPU 상호 연결: NVIDIA® NVLink® with | 시스템 메모리: | 슬롯 수: DIMM 슬롯 32개 최대 메모리(2DPC): 최대 8TB 6400MT/s ECC DDR5 RDIMM |
| 확장 슬롯: | 기본 2개의 PCIe 5.0 x16 FHHL 슬롯 | 구동 베이 구성: | 기본값: 총 베이 8개 전면 핫스왑 E1.S NVMe 드라이브 베이 8개 M.2: M.2 NVMe 슬롯 2개(M 키, S3808N 컨트롤러를 통한 RAID 지원) |
| 전원 공급 장치: | 4X 5250W 중복 (2 + 2) 티타늄 레벨 (96%) 전력 공급 장치 | 총 체중: | 137kg(302파운드) |
| 순 중량: | 119kg(263파운드) | 사용 가능한 색상: | 은 |
| 강조하다: | 8 Onboard GPUs Supermicro GPU SuperServer,NVIDIA HGX B300 8-GPU Supermicro GPU SuperServer,Up to 8TB 6400MT/s ECC DDR5 RDIMM Supermicro GPU SuperServer |
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DP Intel 8U System with NVIDIA HGX B300 8-GPU
Key Applications
Scientific Research, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Finance Services and Fraud Detection, AI/Deep Learning Training and Inference, Large Language Model (LLM) and Generative AI, High Performance Computing (HPC), Autonomous Vehicle Technologies,
Key Features
Dual Intel® Xeon® 6700 series processors with P-cores, up to 350W TDP; 8x B300 Blackwell Ultra SXM GPUs with NVSwitch;
8x CX-8 Integrated 800G NICs supporting IB XDR or ETH 2x400GbE per NIC; 32x DIMM slots supporting up to 8TB of memory;
8x front hot-swap E1.S + 2x M.2 NVMe drive bays;
2x PCIe 5.0 x16 FHHL slots;
1x USB 3.0, 1x USB 2.0, 1x Mini-DP, 1x BMC/IPMI GbE LAN, 2x 10GbE NIC (X710); 6x redundant (3+3) 6.6kW Titanium level power supplies;
8U air-cooled chassis with front I/O;
|
Form Factor |
8U Rackmount Enclosure: 449 x 356 x 950mm (17.6" x 13.8" x 37.4") Package: 1255 x 700 x 750mm (51" x 27.6" x 29.5") |
|
Processor |
Dual Socket E2 (LGA-4710) Intel® Xeon® 6700/6500 series processors with P-cores Up to 128C/256T; Up to 504MB Cache per CPU |
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GPU |
Max GPU Count: 8 onboard GPUs Supported GPU: NVIDIA SXM: HGX B300 8-GPU (288GB) GPU-GPU Interconnect: NVIDIA® NVLink® with NVSwitch™ |
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System Memory |
Slot Count: 32 DIMM slots Max Memory (2DPC): Up to 8TB 6400MT/s ECC DDR5 RDIMM |
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Drive Bays Configuration |
Default: Total 8 bays 8 front hot-swap E1.S NVMe drive bays M.2: 2 M.2 NVMe slots (M-key; RAID support via S3808N controller |
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Expansion Slots |
Default 2 PCIe 5.0 x16 FHHL slots |
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On-Board Devices |
Chipset: System on Chip Network Connectivity: 8 OSFP 800GbE |
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Power Supply |
6x 6600W Redundant (3 + 3) Titanium Level (96%) power supplies |
|
Dimensions and Weight |
Weight: Gross Weight: 302 lbs (137 kg) Net Weight: 263 lbs (119 kg) Available Color: Silver |
