| Formfaktor: | 8U-Rackmontage | Prozessor: | Prozessoren der Intel® Xeon® 6700/6500-Serie mit P-Kernen |
|---|---|---|---|
| GPU: | Maximale GPU-Anzahl: 8 integrierte GPUs. Unterstützte GPU: NVIDIA SXM: HGX B300 8-GPU (288 GB). GPU- | Systemspeicher: | Anzahl der Steckplätze: 32 DIMM-Steckplätze. Maximaler Speicher (2DPC): Bis zu 8 TB 6400 MT/s ECC DD |
| Erweiterungssteckplätze: | Standardmäßig 2 PCIe 5.0 x16 FHHL-Steckplätze | Antriebsschreiben Konfiguration: | Standard: Insgesamt 8 Schächte 8 vordere Hot-Swap-E1.S NVMe-Laufwerksschächte M.2: 2 M.2 NVMe-Steckp |
| Stromversorgung: | 4x 5250W Überflüssige (2 + 2) Titan-Level (96%) Stromversorgung | Bruttogewicht: | 302 Pfund (137 kg) |
| Nettogewicht: | 263 lbs (119 kg) | Verfügbare Farbe: | Silber |
| Hervorheben: | 8 Onboard GPUs Supermicro GPU SuperServer,NVIDIA HGX B300 8-GPU Supermicro GPU SuperServer,Up to 8TB 6400MT/s ECC DDR5 RDIMM Supermicro GPU SuperServer |
||
DP Intel 8U System with NVIDIA HGX B300 8-GPU
Key Applications
Scientific Research, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Finance Services and Fraud Detection, AI/Deep Learning Training and Inference, Large Language Model (LLM) and Generative AI, High Performance Computing (HPC), Autonomous Vehicle Technologies,
Key Features
Dual Intel® Xeon® 6700 series processors with P-cores, up to 350W TDP; 8x B300 Blackwell Ultra SXM GPUs with NVSwitch;
8x CX-8 Integrated 800G NICs supporting IB XDR or ETH 2x400GbE per NIC; 32x DIMM slots supporting up to 8TB of memory;
8x front hot-swap E1.S + 2x M.2 NVMe drive bays;
2x PCIe 5.0 x16 FHHL slots;
1x USB 3.0, 1x USB 2.0, 1x Mini-DP, 1x BMC/IPMI GbE LAN, 2x 10GbE NIC (X710); 6x redundant (3+3) 6.6kW Titanium level power supplies;
8U air-cooled chassis with front I/O;
|
Form Factor |
8U Rackmount Enclosure: 449 x 356 x 950mm (17.6" x 13.8" x 37.4") Package: 1255 x 700 x 750mm (51" x 27.6" x 29.5") |
|
Processor |
Dual Socket E2 (LGA-4710) Intel® Xeon® 6700/6500 series processors with P-cores Up to 128C/256T; Up to 504MB Cache per CPU |
|
GPU |
Max GPU Count: 8 onboard GPUs Supported GPU: NVIDIA SXM: HGX B300 8-GPU (288GB) GPU-GPU Interconnect: NVIDIA® NVLink® with NVSwitch™ |
|
System Memory |
Slot Count: 32 DIMM slots Max Memory (2DPC): Up to 8TB 6400MT/s ECC DDR5 RDIMM |
|
Drive Bays Configuration |
Default: Total 8 bays 8 front hot-swap E1.S NVMe drive bays M.2: 2 M.2 NVMe slots (M-key; RAID support via S3808N controller |
|
Expansion Slots |
Default 2 PCIe 5.0 x16 FHHL slots |
|
On-Board Devices |
Chipset: System on Chip Network Connectivity: 8 OSFP 800GbE |
|
Power Supply |
6x 6600W Redundant (3 + 3) Titanium Level (96%) power supplies |
|
Dimensions and Weight |
Weight: Gross Weight: 302 lbs (137 kg) Net Weight: 263 lbs (119 kg) Available Color: Silver |
![]()
![]()
![]()